Soldering & Surface Mount Technology: Volume 28 Issue 1

Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes

Balázs Illés, Olivér Krammer, Attila Géczy, Tamás Garami

The purpose of this paper is to present a novel and alternative method for the characterization of isotropic conductive adhesive (ICA) joints’ conductivity by the calculation of…

Comparative study on proper thermocouple attachment for vapour phase soldering profiling

Attila Géczy, Bíborka Kvanduk, Balazs Illes, Gábor Harsányi

The paper aims to present a comparative study of various thermocouple (TC) attaching methods for the proper measurement of soldering temperature profiling during vapour phase…

Method for validating CT length measurement of cracks inside solder joints

Tamás Garami, Oliver Krammer, Gábor Harsányi, Péter Martinek

– This paper aims to develop a method to measure the length of cracks inside solder joints, which enables the validation of computed tomography (CT) crack length measurements.

Mechanical reliability of solder joints in PCBs assembled in surface mount technology

Janusz Borecki, Tomasz Serzysko

The purpose of this paper is to determine the dependence of mechanical strength of solder joints on printed circuit boards from the soldering process parameters and operating…

Mechanical properties of SMD interconnections on flexible and rigid substrates

Damian Nowak, Andrzej Dziedzic, Zbigniew Żaluk, Henryk Roguszczak, Mariusz Węglarski

– The paper aims to investigate on the mechanical properties of surface-mount device (SMD) interconnections made on flexible and rigid substrates.

Influence of mechanical exposures on electrical properties of thin and thick-film flexible resistors and conductors

Paweł Osypiuk, Andrzej Dziedzic, Wojciech Stęplewski

The purpose of this paper is to determine the influence of mechanical factors (such as longitudinal elongation or cyclic compressive and tensile stresses) on electrical properties…

Guest editorial

Agata Skwarek