Soldering & Surface Mount Technology: Volume 27 Issue 1

Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects

Jae B. Kwak, Soonwan Chung

The purpose of this paper is to assess the thermo-mechanical reliability of a solder bump with different underfills, with the evaluation of different underfill materials. As there…

Research and prospect of binary high-temperature Pb-free solders

Yunfei Du, Chuntian Li, Bin Huang, Ming Tang, Changhua Du

This paper aims to identify a variety of binary system solders by alloying, and relevantly derive multiple system Pb-free solders from the former, attempting to replace the high…

Electrical and mechanical properties of RFID chip joints assembled on flexible substrates

Kamil Janeczek, Małgorzata Jakubowska, Grażyna Kozioł, Anna Młożniak

The purpose of this paper is to examine electrical and mechanical properties of radio frequency identification (RFID) chip joints assembled on a flexible substrate and made from…

A new approach to investigate conductive anodic filament (CAF) formation

Ling Chunxian Zou, Chris Hunt

This paper aims to describe the development of an approach that uses a flexible substrate to investigate the mechanism of conductive anodic filament (CAF) growth and effect of…

Thermal fluid-structure interaction of PCB configurations during the wave soldering process

M.S. Abdul Aziz, M.Z. Abdullah, C.Y. Khor

This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering…

Effect of Au-Sn IMCs’ formation and morphologies on shear properties of laser reflowed micro-solder joints

Wei Liu, Rong An, Chunqing Wang, Yanhong Tian

The purpose of this paper is to investigate the effect of typical morphologies of Au-Sn IMCs (intermetallic compounds) at the interfaces of solder and pads on shear properties of…

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

Peter K. Bernasko, Sabuj Mallik, G. Takyi

The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints…