Table of contents
Temperature cycling with Peltier elements of boards with SMD components and failure evaluation
Josef Šandera, Michal NicákThis article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. This article describes the…
Reliability analysis of an ACA attached flex-on-board assembly for industrial application
Janne Kiilunen, Laura FriskThe purpose of this paper is to examine the long-term reliability of an anisotropic conductive adhesive (ACA) attached polyethylene terephthalate (PET) flex-on-board (FOB…
Statistical analysis of stencil technology for wafer-level bumping
Robert W. Kay, Gerard Cummins, Thomas Krebs, Richard Lathrop, Eitan Abraham, Marc DesmulliezWafer-level stencil printing of a type-6 Pb-free SAC solder paste was statistically evaluated at 200 and 150 μm pitch using three different stencil manufacturing technologies…
Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution
Liu Mei Lee, Muhammad Firdaus Mohd Nazeri, Habsah Haliman, Ahmad Azmin Mohamad– The purpose of this paper is to examine the corrosion behaviors of SAC305 thin film solder alloy in 6 M KOH solution.
Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow
J. Mittal, K.L. LinThis paper aims to compare the reflow and Zn diffusion behaviors in Sn-Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (5E) solders during soldering on a Ni/Cu substrate under infrared (IR…

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang