Table of contents
Characteristics and properties of Bi‐11Ag solder
Roman Koleňák, Michal ChachulaThe purpose of this paper is to study Bi‐11Ag solder for higher application temperatures. The aim of the research work was to determine the soldering, thermal and mechanical…
Electrodeposition of lead‐free solder alloys
Yingxin Goh, A.S.M.A. Haseeb, Mohd Faizul Mohd SabriThe purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve…
Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn‐3.8Ag‐0.7Cu solder and copper substrate
Y.H. Chan, M.M. Arafat, A.S.M.A. HaseebThe purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn‐3.8Ag‐0.7Cu (SAC) solder and Cu…
Characterization of vapour phase soldering process zone with pressure measurements
Attila Géczy, Balázs Illés, Zsolt Péter, Zsolt Illyefalvi‐VitézThe purpose of this paper is to present a novel approach on the process zone characterization for direct feedback regarding the state of vapour, in order to assure a better…
Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste
Yunhui Mei, Gang Chen, Xin Li, Guo‐Quan Lu, Xu ChenThe purpose of this paper is to determine: how much the residual curvature could be formed in sintered nano‐silver assembly when it is cooled to room temperature from the…
Applying CHAID algorithm to investigate critical attributes of void formation in QFN assembly
Chien‐Yi Huang, Yueh‐Hsun LinThe purpose of this paper is to employ data mining as a new diagnosing scheme for investigating void formation to the thermal pad in quad flat non‐lead (QFN) assembly. Occurrences…

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang