Table of contents
Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints
Liang Zhang, Song‐bai Xue, Li‐li Gao, Zhong Sheng, Wei Dai, Feng Ji, Huan Ye, Yan Chen, Sheng‐lin YuThe purpose of this paper is to explore the formation and growth mechanism of bulk Cu6Sn5 intermetallic compounds, selecting Sn‐Ag‐Cu‐Ce solders as specimens.
Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing
S.L. Tay, A.S.M.A. Haseeb, Mohd Rafie JohanThe purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn‐3.8Ag‐0.7Cu solder.
Development of a lead‐free solder: Sn‐4.0Bi‐3.7Ag‐0.9Zn
Xun Wang, Yongchang Liu, Liming Yu, Zhizhong Dong, Zhiming GaoThe purpose of this paper is to study the relationship between microstructure and mechanical properties of Sn‐4.0Bi‐3.7Ag‐0.9Zn (in wt%) solder, and the structural evolution of…
Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders
Z. Moser, P. Fima, K. Bukat, J. Sitek, J. Pstruś, W. Gąsior, M. Kościelski, T. GancarzThe purpose of this paper is to investigate the influence of In additions on the wetting properties of the Sn2.86Ag0.40Cu (in wt%) eutectic‐based alloys, on a copper substrate, in…
Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies
O. Nousiainen, T. Kangasvieri, R. Rautioaho, J. VähäkangasThe purpose of this paper is to investigate the thermal fatigue endurance of two lead‐free solders used in composite solder joints consisting of plastic core solder balls (PCSB…
A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints
Bo Wang, Fengshun Wu, Yiping Wu, Bing An, Hui Liu, Jian ZouThe purpose of this paper is to identify the solder joint with optimal mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints.

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang