Table of contents - Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07)
Guest Editors: Professor Johan Liu, Dr Daoqiang Lu, Dr Cristina Andersson
Properties of two new medium temperature solders
Chunyuan Li, Xitao Wang, Wenxia YuanThe increasing utilization of Al‐matrix composites in electronics packaging industry raises demands of solder materials with melting temperature at 400‐500°C. The purpose of this…
Melting temperature depression of Sn‐0.4Co‐0.7Cu lead‐free solder nanoparticles
C.D. Zou, Y.L. Gao, B. Yang, Q.J. Zhai, C. Andersson, J. LiuThe purpose of this paper is to study the melting temperature of the nanoparticles of the new developed Sn‐0.4Co‐0.7Cu (wt%) lead‐free solder alloy.
The growth behaviours of IMC layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields
Cong‐qian Cheng, Jie Zhao, Yang Xu, Fu‐Min Xu, Ming‐liang HuangThe aim of this paper is to investigate the growth behaviours of intermetallic compound (IMC) layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in various intensities of…
Interfacial reactions between Sn‐Cu based multicomponent solders and Ni substrates during soldering and aging
Ning Zhao, Hai‐tao Ma, Lai WangThe paper aims to investigate the interfacial reactions between two Sn‐Cu based multicomponent Pb‐free solders, Sn‐2Cu‐0.5Ni and Sn‐2Cu‐0.5Ni‐0.5Au (wt per cent), and Ni…
Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)
M. Norén, S. Brunner, C. Hoffmann, W. Salz, K. AichholzerOne of the major driving forces for the electronic industry is the consumer handheld units, where even more functions in a smaller volume and with longer battery time are…
Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages
C. Andersson, B. Vandevelde, C. Noritake, P. Sun, P.E. Tegehall, D.R. Andersson, G. Wetter, J. LiuThe purpose of this paper is to assess the effect of different temperature cycling profiles on the reliability of lead‐free 388 plastic ball grid array (PBGA) packages and to…
A study of thermo‐mechanical reliability of lead‐free PTH solder joints
Jennifer Nguyen, David Geiger, Dan Rooney, Dongkai ShangguanThe purpose of this paper is to consider PTH solder joint reliability, particularly on the PTH solder joints with partial hole‐fill and without pin protrusion. Also, the impact of…
Coffin‐Manson equation of Sn‐4.0Ag‐0.5Cu solder joint
S. Chen, P. Sun, X.C. Wei, Z.N. Cheng, J. LiuThe purpose of this paper is to fit Coffin‐Manson equation of Sn‐4.0Ag‐0.5Cu lead free solder joint by using results of solders joint reliability test and finite element analysis…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang