Table of contents
Reduced temperature soldering of capacitors using Sn‐Bi plated Sn‐3.5%Ag
Mi Jin Kim, Y. (Norman) Zhou, Jae Pil JungThis paper seeks to decrease the soldering temperature of capacitors using Sn‐Bi plated Sn‐3.5 wt%Ag solder.
393
The evolution of paste pressure during stencil printing
David J. Clements, Marc P.Y. Desmulliez, Eitan AbrahamThe objective of this investigation is the derivation of a mathematical model that describes the pressure characteristics of paste during the stencil printing process. This model…
479
Interfacial reactions between Sn‐based solders and AgPt thick film metallizations on LTCC
Olli Nousiainen, Tero Kangasvieri, Kari Rönkä, Risto Rautioaho, Jouko VähäkangasThis paper aims to investigate the metallurgical reactions between two commercial AgPt thick films used as a solder land on a low temperature co‐fired ceramic (LTCC) module and…
329
Multiphysics simulation of microwave curing in micro‐electronics packaging applications
T. Tilford, K.I. Sinclair, C. Bailey, M.P.Y. Desmulliez, G. Goussettis, A.K. Parrott, A.J. SangsterThis paper aims to present an open‐ended microwave curing system for microelectronics components and a numerical analysis framework for virtual testing and prototyping of the…
453
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang