Soldering & Surface Mount Technology: Volume 18 Issue 4

Subject:

Table of contents

Laser soldering control using optical imaging

James M. Gilbert, Zaif Dabestani

The use of lasers to selectively solder joints in electronic assemblies has a number of advantages over methods which involve heating of the whole assembly. However, the localised…

Reliability of ACA bonded flip chip joints on LCP and PI substrates

Laura Frisk, Anne Cumini

The purpose of this study is to investigate the reliability of flip chip joints made with anisotropic conductive adhesives (ACA) on flexible polyimide (PI) and liquid crystal…

Failure analysis techniques for lead‐free solder joints

Todd Castello, Dan Rooney, Dongkai Shangguan

This paper aims to describe and document the application of commonly utilized solder joint failure analysis techniques to lead‐free solder joints.

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The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

Laura Frisk, Kati Kokko

The purpose of this study is to investigate the effect of chip and substrate thickness on the thermal cycling reliability of flip chip joints assembled with anisotropic conductive…

Determining conformal coating protection

Christopher Hunt, Angela Mensah, Anthony Buxton, Richard Holman

This work sets out to characterise the protective properties of conformal coatings and how they degrade.

The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Jianbiao Pan, Brian J. Toleno, Tzu‐Chien Chou, Wesley J. Dee

The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.

Cover of Soldering & Surface Mount Technology

ISSN:

0954-0911

Online date, start – end:

1989

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editors:

  • Professor Peng He
  • Associate Professor Shuye Zhang