Table of contents
A novel crack and delamination protection mechanism for a WLCSP using soft joint technology
Ming‐Chih Yew, Chien‐Chia Chiu, Shu‐Ming Chang, Kuo‐Ning ChiangThe coefficient of thermal expansion (CTE) mismatch between silicon and organic printed circuit board (PCB) materials causes a reliability issue for ball grid array type…
Learning from the migration to lead‐free solder
Richard Ciocci, Michael PechtThe purpose of this paper is to characterize the motivations used into migrating to lead‐free solder by providing examples and directions for those making the material change.
Minimizing flux spatter during lead‐free reflow assembly
Deepak Manjunath, Satyanarayan Iyer, Shawn Eckel, Purushothaman Damodaran, Krishnaswami SrihariThe leaching of lead from electronic components in landfills to ground water is harmful to health and to the environment. Increasing concern over the use of lead in electronics…
Dissolution of stainless steels in molten lead‐free solders
Tadashi Takemoto, Masaharu TakemotoTo determine the endurance of stainless steels used for wave soldering container materials in molten lead‐free solders.
Characterization of tin oxidation products using sequential electrochemical reduction analysis (SERA)
D.D. Hillman, L.S. ChumbleyTo evaluate the oxide formation characteristics of tin (Sn) as a function of conditioning treatment and define a conditioning methodology that rapidly produces a tin oxide…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang