Soldering & Surface Mount Technology: Volume 18 Issue 1

Subject:

Table of contents

RLC effects in fine pitch anisotropic conductive film connections

G. Dou, Y.C. Chan, J.E. Morris, D.C. Whalley

The resistance, capacitance and inductance of anisotropic conductive film (ACF) connections determine their high frequency electrical characteristics. The presence of capacitance…

Implementing lead‐free solders – the performance aspects

W.J. Plumbridge

To draw attention to the need to consider design and performance, as well as production, in the implementation of lead‐free solders.

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre‐strained eutectic Sn‐3.5Ag solder joints

H. Rhee, K.N. Subramanian

To understand the roles of service‐related parameters, such as imposed cyclic strain amplitude and cyclic strain rate, on the stress relaxation behaviour of eutectic Sn‐Ag solder…

1015

Design of a flexible assembly and remanufacturing cell for advanced SM components: selection of cell design concept based on reflow tools

N. Geren, M. Çakirca, M. Bayramoğlu

To design a flexible integrated robotic assembly and rework (remanufacturing) cell for assembly, selective assembly and rework of advanced surface mount components (SMCs) using…

Modelling of microstructure and damage evolution in Sn‐Pb solder

Y. Wei, C.L. Chow, H.E. Fang, W.Y. Lu, J. Lim

This paper aims to present a viscoplastic constitutive model of Sn‐Pb solder taking into account the evolution of microstructure and damage growth in the material.

Cover of Soldering & Surface Mount Technology

ISSN:

0954-0911

Online date, start – end:

1989

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editors:

  • Professor Peng He
  • Associate Professor Shuye Zhang