Table of contents
Effect of PCB surface finish on creep properties of lead‐free solder joints
Janne J. Sundelin, Sami T. Nurmi, Toivo K. Lepistö, Eero O. RistolainenTo provide further knowledge of the effect of solder composition and PCB surface finish on the creep properties of lead‐free SnAgCu solder joints.
Degradation of Sn‐Ag‐Cu heat‐sink attachment during thermal shock cycling
Junling Chang, Dirk Janz, W. Kempe, Xiaoming XieTo investigate the degradation of lead free solder heat‐sink attachment by thermal shock. Samples with high voiding percentages were selected for the investigation in order to get…
Correlation between jamming and skipping during solder paste printing
S.R. Hillman, S.H. Mannan, R. Durairaj, A. Seman, N.N. Ekere, M. Dusek, C. HuntTo investigate how jamming of particles in a solder paste varies as a function of the gap through which the particles flow, and to correlate this with skipping defects during the…
Investigation of the effect of solder flux residues on RF signal integrity using real circuits
David Geiger, Dongkai ShangguanProvide information on the effects of flux residues from surface mount assembly on radio frequency (RF) performance.
Lead‐free PCB assembly and effects of process conditions on the profile and reliability of solder joints
Z.W. Zhong, P. Arulvanan, X.Q. ShiTo study the effects of design and assembly process conditions on lead‐free solder joints for an area array component.
Low cycle fatigue testing and simulation of Sn‐8Zn‐3Bi and Sn‐37Pb solder joints
Peng Sun, Cristina Andersson, Xicheng Wei, Liqiang Cao, Zhaonian Cheng, Johan LiuSn‐Zn based lead free solders with a melting temperature around 199°C are an attractive alternative to the conventional Sn‐Pb solder and the addition of bismuth improves its…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang