Table of contents
Fluxless plasma bumping of lead‐free solders and the reliability effects of under bump metallization thickness
Joon Kwon Moon, Y. Zhou, Jae Pil JungTo investigate fluxless plasma ball bumping and effect of under bump metallization (UBM) thickness on joint properties using lead‐free solders.
Microstructural investigation of lead‐free BGAs soldered with tin‐lead solder
Günter Grossmann, Joy Tharian, Pascal Jud, Urs SennhauserThe goal of this work is to evaluate the feasibility of soldering tin‐silver‐copper balled BGAs using tin‐lead‐based solder and to investigate the influence of different…
The impact of thermal cycling regime on the shear strength of lead‐free solder joints
Milos Dusek, Martin Wickham, Christopher HuntThe purpose of this work is to undertake a comparison of accelerated test regimes for assessing the reliability of solder joints, in particular those made using lead‐free solders.
A systematic procedure for the selection of a lead‐free solder paste in an electronics manufacturing environment
Girish S. Wable, Quyen Chu, Purushothaman Damodaran, Krishnaswami SrihariHistorically, tin‐lead solder has been a commonly used joining material in electronics manufacturing. Environmental and health concerns, due to the leaching of lead from landfills…
The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing
M.J. Rizvi, Y.C. Chan, C. Bailey, H. Lu, A. SharifAnisotropic conductive film (ACF) is now an attractive technology for direct mounting of chips onto the substrate as an alternative to lead‐free solders. However, despite its…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang