Table of contents
Design for lead‐free solder joint reliability of high‐density packages
John Lau, Walter Dauksher, Joe Smetana, Rob Horsley, Dongkai Shangguan, Todd Castello, Irv Menis, Dave Love, Bob SullivanThe lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element…
Reflow profile study of the Sn‐Ag‐Cu solder
B. Salam, C. Virseda, H. Da, N.N. Ekere, R. DurairajA study of the Sn‐Ag‐Cu lead‐free solder reflow profile has been conducted. The purpose of the work was to determine the Sn‐Ag‐Cu reflow profile that produced solder bumps with a…
Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings
Minna Arra, Todd Castello, Dongkai Shangguan, Eero RistolainenThe mechanical properties of Sn/Ag/Cu solder joints in combination with different component lead coating materials (Ni/Pd/Au, Sn/15 per cent Pb, Sn/2 per cent Bi, and Sn) are…
The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow
Timo Liukkonen, Pekka Nummenpää, Aulis TuominenThe electronics industry will implement lead‐free soldering in the near future. Lead‐free implementation steps are divided into lead‐free process and lead‐free product. The…
Thermal fatigue cracking of surface mount conductive adhesive joints
Zhimin Mo, Zonghe Lai, Shiming Li, Johan LiuElectrically conductive adhesives are considered to be strong candidates for replacing toxic lead‐based solders. The present work has focused on thermal fatigue cracking of…
Design, materials and process for lead‐free assembly of high‐density packages
Joe Smetana, Rob Horsley, John Lau, Ken Snowdon, Dongkai Shangguan, Jerry Gleason, Irv Memis, Dave Love, Walter Dauksher, Bob SullivanThe High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and…

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang