Table of contents
Contact resistance of metal‐coated polymer particles used in anisotropically conductive adhesives
Jarmo MäättänenThe increasing demand for fine pitch interconnections has led to a growth of interest in anisotropically conductive adhesives (ACAs) as an alternative to solder joints in high…
Reducing bonding cycle time of adhesive flip chip process
Anne Seppälä, Kati Aalto, Eero RistolainenFlip chip assembly using anisotropic conductive adhesives offers an interesting alternative for making high‐density interconnections. The use of conventional organic printed…
Finite element analysis of a three‐dimensional package
Zhaowei Zhong, Peng Kiong YipA three‐dimensional (3D) package consisting of a stack of three silicon chips was conceptually designed. A finite element simulation of this 3D package was conducted in order to…
The analysis of creep data for solder alloys
W.J. PlumbridgeWith the continued miniaturisation of electronics equipment, a more detailed examination of the mechanical behaviour of solders is required to ensure reliability in performance…
The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs
S.T. Nurmi, J.J. Sundelin, E.O. Ristolainen, T. LepistöLead‐free soldering is becoming a common practice in the electronics industry because of the growing general opposition to lead‐containing solders. The reliability of lead‐free…
Creep behaviour of composite lead‐free electronic solder joints
F. Guo, J. Lee, K.N. SubramanianIn an attempt to improve service life of lead‐free Sn‐based electronic solder joints, compatible reinforcements were introduced by in‐situ and mechanical mixing methods. The…
Fine pitch stencil printing using enclosed printing systems
Ling Chunxian Zou, Milos Dusek, Martin Wickham, Christopher HuntEnclosed print heads have recently been developed as an improvement on the traditional squeegee methods for solder paste printing. They offer the opportunity of widening the…
Advanced alloy for lead‐free solder balls
Marc Dittes, Hermann WalterA new alloy for lead‐free solder balls is introduced combining the advantages of a smooth surface after production and a uniform reflectivity after the ball attach process. This…
ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang