Table of contents
Intermetallic morphology around Ni particles in Sn‐3.5Ag solder
J.G. Lee, F. Guo, K.N. Subramanian, J.P. LucasThe influence of the thermal reflow profile on the formation and resultant morphology of the intermetallic layer that developed at the Ni particle reinforcements within an…
Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards
Minna Arra, Dongkai Shangguan, Eero Ristolainen, Toivo LepistöThe wetting performance and intermetallic formation of a Sn/Ag/Cu alloy on printed circuit board (PCB) surfaces and on component terminations were studied in this work. Two…
A methodology to establish baseline metrics for assessing the isothermally aging of Sn‐Pb solder interconnects
P.T. Vianco, J.A. RejentA methodology was developed to establish baseline metrics for assessing the isothermal aging of 63Sn‐37Pb (or 60Sn‐40Pb) solder joints in circuit board assemblies. Those metrics…
Reliability of tin‐lead balled BGAs soldered with lead‐free solder paste
Sami Tapani Nurmi, Eero Olavi RistolainenThis paper will describe tests of the interconnect reliability of BGA components with tin‐lead bumps soldered with lead‐free solder paste during temperature cycling. Tin‐lead BGA…
Solder ball failure mechanisms in plastic ball grid array packages
C.H. Zhong, S. Yi, D.C. WhalleyPlastic ball grid array packages were aged for up to 2000 hours. Various solder ball pad metallurgies were studied and solder ball shear tests were conducted at a range of ageing…
Degradation of flip‐chip‐on‐glass interconnection with ACF under high humidity and thermal aging
C.M. Lawrence Wu, M.L. ChauThis paper presents a reliability assessment of adhesive joints using chip‐on‐glass (COG) technology which was conducted by testing samples at various aging temperatures and at…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang