Table of contents
Ceramic chip scale package solder joint reliability
J. Seyyedi, J. PadgettAs part of a programme of characterisation of interconnection technologies for computer server products the present investigation was conducted to determine the attachment…
The effect of PECVD SiNx moisture barrier layers on the degradation of a flip chip underfill material
G. Kaltenpoth, W. Siebert, X‐M. Xie, F. StubhanFlip chip test boards with and without plasma enhanced chemical vapor deposition silicon nitride moisture barrier coatings were exposed to high humidity and temperature cycling…
Microstructure investigation of Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B lead‐free solders
L. Ye, Z.H. Lai, J. Liu, A. ThölénIdentifies the intermetallics formed in Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B (wt%) lead‐free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were…
Lead‐free reflow soldering for electronics assembly
M.R. Harrison, J.H. Vincent, H.A.H. SteenResults for reflow soldering are presented from a three‐year EC funded project “IDEALS” to develop lead‐free soldering solutions. On the basis of fundamental data from the…
ACA bonding technology for low cost electronics packaging applications – current status and remaining challenges
Johan LiuAnisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for over a decade on glass substrates, and more recently in contactless smart‐card module…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang