Table of contents
Wettability test method for surface mount technology assessment
C.C. Tu, M.E. NatishanA study was performed to develop a different experimental methodology to assess wettabilities of solders on various printed wiring board (PWB) finishes, based on a modified…
Solder joint reliability of plastic ball grid array with solder bumped flip chip
Shi‐Wei Ricky Lee, John H. LauA computational parametric study on the solder joint reliability of a plastic ball grid array (PBGA) with solder bumped flip chip (FC) is presented. The basic configuration of the…
The impact of process parameters on gold elimination from soldered connector assemblies
P.T. Vianco, A.C. KilgoGold coatings are used on connector structures to maintain suitable solderability of the underlying Ni coating layer as well as to prevent surface corrosion during service…
Viscoplastic Anand model for solder alloys and its application
Z.N. Cheng, G.Z. Wang, L. Chen, J. Wilde, K. BeckerA viscoplastic constitutive model, the Anand model, in which plasticity and creep are unified and described by the same set of flow and evolutionary relations, was applied to…
The impact of underfill properties on the thermomechanical reliability of FCOB assembly
Jicun Lu, Jianhua Wu, Yih Pin Liew, Thiam Beng Lim, Xiangfu ZongThe impact of underfill properties on the thermomechanical reliability of flip chip on board (FCOB) assembly is addressed in this paper. FCOB assemblies using three underfill…
TBGA reliability in telecom environment
Virpi Pennanen, Markku Tammenmaa, Tommi Reinikainen, Jiansen Zhu, Wei LinOwing to the demands of increasing I/O counts and thermal performance BGA (ball grid array) type packaging concepts are rapidly gaining in popularity. Use of various modelling…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang