Table of contents
Materials behaviour and the reliability in performance of solder joints
W.J. PlumbridgeWhile the implementation of lead‐free solder technology has been the focus of much recent research, the challenge of joint structural integrity should not be overlooked. The paper…
Survey of rework practices in the UK electronics assembly industry
M. Wickham, C.P. HuntA survey of rework practices of the UK electronics assembly industry has been undertaken. Rework of electronics components in the UK was found to be dominated by the use of…
Characterization of a solder paste printing process and its optimization
Gary K.K. Poon, D.J. WilliamsThe objectives of this research are to model the screening process with planned experiments and to identify the optimal setting of the process parameters so as to minimize the…
Analysis of crack growth in solder joints
Dongkai ShangguanUnderstanding crack growth in solder joints is important for predicting the fatigue life of solder interconnects. In this paper, crack propagation in solder joints made of two…
Enhancement of underfill encapsulants for flip‐chip technology
M.B. Vincent, C.P. WongThis paper presents results on adding silane coupling agents to the underfill encapsulant to enhance the rheology and wetting of the underfill. These results include rheology…
PBGA solder ball coplanarity impact evaluation
Tony Huang, Joe ChuA study was conducted to examine the sensitivity of solder joint integrity for PBGA assembly and post rework process yields to the change of the solder ball coplanarity…
Interfacial reactions of tin‐zinc‐bismuth alloys
Paul HarrisA variety of lead‐free solders are now commercially available. Of those suitable for mass soldering perhaps the ones closest to a direct, drop‐in, replacement for tin‐lead are the…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang