Table of contents
Novel techniques for electronic component removal
A.D. Stennett, D.C. WhalleyComponent removal for rework and repair is traditionally achieved by re‐melting of the solder, but the exposure of the assembly or its component parts to repeated soldering…
Reduction of voiding in eutectic ball grid array solder joints
William CaseyThe rapid progress of ball grid array (BGA) component technology has served to alleviate many problems associated with the placement and soldering of high lead count, fine pitch…
TMA, DMA, DSC and TGA of lead free solders
John H. Lau, Chris ChangMost of the electronics packaging materials, especially solders, are temperature dependent. Their temperature‐dependent material properties can be obtained by TMA (thermal…
CSP compatibility in the SMT assembly process
L. Alex Chen, Irene Sterian, Brian Smith, Damien KirkpatrickTo achieve integration of chip scale package (CSP) devices into main stream surface mount technology (SMT) assembly, various experiments have been required. In process…
Surface insulation resistance (SIR) response to various processing parameters
Ling Zou, Christopher HuntSIR testing is in practice carried out under a wider range of experimental conditions than those detailed in standards. The work presented here explores some of the issues when…
Mechanical stress and deformation of SMT components during temperature cycling and PCB bending
Reiner W. KühlA very common method to predict the reliability of components soldered on printed circuit board (PCB) or substrates is by bending tests and temperature cycle tests, for instance…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang