Table of contents
Influences of storage conditions on component cracking
Klaus Feldmann, Robert Feuerstein, Knuth GötzAt the Institute for Manufacturing Automation and Production Systems (FAPS), in Erlangen, Germany, the influence of different storage conditions on cracking behaviour of…
Finite element modelling of printed circuit boards (PCBs) for structural analysis
Miky LeeConsiders a process for better mechanical design of printed circuit boards (PCBs) which suffer from warpage during the assembly process. During the reflow process, PCBs experience…
Gallium‐based interconnects for flip‐chip assembly
Adam A. StanfieldA feasibility study into alternative methods of producing interconnection between a PCB and flip‐chip has been undertaken. A number of initial ideas were investigated, the least…
Verification of flip‐chip assembly on FR4 boards
Caroline Beelen‐Hendrikx, Martin VerguldAs a result of the trend towards portable communication products, low‐cost miniaturisation is becoming increasingly important. One of the methods to achieve low‐cost…
Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesion
Se‐Young Jang, Kyung‐Wook PaikIn flip‐chip interconnection on organic substrates using eutectic tin/lead solder bumps, a highly reliable under bump metallurgy (UBM) is required to maintain adhesion and solder…
The role of intermetallic compounds in lead‐free soldering
Paul G. Harris, Kaldev S. ChaggarThe role of intermetallics in soldered joints is ambivalent. They are an essential part of joints to common basis materials and at low levels they have a strengthening effect on…

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang