Circuit World: Volume 43 Issue 1

Guest editorial

Agata Skwarek

Investigation of nano-inks’ behaviour on flexible and rigid substrates under various conditions

Peter Lukacs, Alena Pietrikova, Beata Ballokova, Dagmar Jakubeczyova, Ondrej Kovac

This paper aims to find the optimal deposition conditions for achieving the homogenous structure of the silver layers onto three types of polymeric substrates as well as on the…

Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates

Aneta Arazna, Kamil Janeczek, Konrad Futera

This paper aims to present the results of investigations of inkjet-printed electronic circuits fabricated on a flexible substrate (KAPTON foil) using silver nanoparticles ink.

Drops forming in inkjet printing of flexible electronic circuits

Grzegorz Tomaszewski, Jerzy Potencki

This paper aims to study drop formation in piezoelectric industrial printheads during the inkjet printing processes. It presents how the piezoelectric printhead forms drops of…

Assessment of stability and reliability of embedded components in printed circuit boards

Wojciech Steplewski, Andrzej Dziedzic, Janusz Borecki, Tomasz Serzysko

The purpose of this paper is to investigate the basic functional parameters of passive embedded components in printed circuit boards (PCBs) under environmental exposures such as…

Effects of varying laser trimming geometries on thin film resistors

Maria Alafogianni, Martin Birkett, Roger Penlington

This paper aims to study the effects of varying laser trim patterns on several performance parameters of thin film resistors such as the temperature coefficient of resistance…

RFID monitoring system of fiber optic connectors

Bartlomiej Guzowski, Roman Gozdur, Mateusz Lakomski, Lukasz Bernacki

The purpose of this paper is to develop identification system for fiber optic connectors in passive distribution cabinets. The system should have alternative power supply and…

Investigations of mutual thermal coupling between SiC Schottky diodes situated in the common case

Krzysztof Górecki, Damian Bisewski, Janusz Zarębski, Ryszard Kisiel, Marcin Myśliwiec

This paper aims to present the results of measurements and calculations illustrating mutual thermal coupling between power Schottky diodes made of silicon carbide situated in the…