Circuit World: Volume 39 Issue 3


Table of contents

PCB failure analysis related to the ENIG black pad problem

Rimantas Ramanauskas, Algirdas Selskis, Jurga Juodkazyte, Vitalija Jasulaitiene

The purpose of this paper is to verify the principal conclusions, done during the implementation of FP7 ASPIS project objectives in fundamental research of ENIG‐related failures…


Failure mechanism of solder bubbles in PCB vias during high‐temperature assembly

Yuanming Chen, Wei He, Guoyun Zhou, Zhihua Tao, Yang Wang, Daojun Luo

Pb‐free soldering challenged printed circuit board (PCB) assembly with high temperature. The purpose of this paper is to explain the failure mechanism of printed circuit board…

Preparation and performances of coated and aluminous entry boards with endothermic and lubricant resins for PCB drilling

Hu Zhou, Ruiping Xun, Qingquan Liu, Peng Wu

The purpose of this paper is to provide a new entry board for drilling holes on the PCBs, superior in heat removal effect, lubricating effect and hole locating effect in forming…

A solution for micro drill condition monitoring with vibration signals for PCB drilling

Qinglong An, Dapeng Dong, Xiaohu Zheng, Ming Chen, Xibin Wang

The objective of this study is to develop an automated tool condition monitoring scheme for PCB drilling.

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  • Associate Professor Pooya Davari