Circuit World: Volume 35 Issue 4


Table of contents

Reliability testing for microvias in printed wire boards

Bill Birch

The purpose of this paper is to identify and expand upon the understanding of the reliability of high density interconnect (HDI) technologies containing multi‐level microvia…

High aspect ratio “multiple wire” microvias in flexible PCBs

Mikael Lindeberg, Klas Hjort

The purpose of this paper is to present an update and the latest results from work on high aspect ratio “multiple wire” microvias in porous flexible Kapton foils for printed…

Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards

Teija Laine‐Ma, Pekka Ruuskanen, Satu Kortet, Mikko Karttunen

The adhesion between electroless copper and a substrate is one of the most important factors in the reliability of thermoplastic printed circuit boards. The purpose of this paper…


Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP)

Rabindra N. Das, Steven G. Rosser, Konstantinos I. Papathomas, Tim Antesberger, Voya R. Markovich

Embedded passives account for a very large part of today's electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers, and…

Assembly of flexible RFID tag inlays with anisotropic conductive paste (ACP)

Xiong‐hui Cai, Bing An, Feng‐shun Wu, Yi‐ping Wu

The purpose of this paper is to accomplish the low cost mass‐production of flexible radio frequency identification (RFID) tag inlays.

High quality laser cutting of electronic printed circuit board substrates

X.C. Wang, H.Y. Zheng

The purpose of this paper is to discuss laser cutting of FR4, and BT/Epoxy‐based PCB substrates with 355 nm DPSS UV laser.

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  • Associate Professor Pooya Davari