Circuit World: Volume 35 Issue 2


Table of contents

A direct‐writing approach to the micro‐patterning of copper onto polyimide

J.H.‐G. Ng, M.P.Y. Desmulliez, M. Lamponi, B.G. Moffat, A. McCarthy, H. Suyal, A.C. Walker, K.A. Prior, D.P. Hand

The purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process…

Cracking phenomena on flexible‐rigid interfaces in PCBs under thermo cycling loading

Luciano Arruda, Renato Bonadiman, Josineto Costa, Tommi Reinikainen

The purpose of this paper is to develop simulation models for flexible‐printed circuit boards' flex‐rigid interfaces and to perform experimental tests in the laboratory in order…

A multilayer process for the connection of fine‐pitch‐devices on molded interconnect devices (MIDs)

Thomas Leneke, Soeren Hirsch, Bertram Schmidt

The purpose of this paper is to present a new multilayer process for three‐dimensional molded interconnect devices (3D‐MIDs) that allows the assembly of modern area array packaged…

Low‐power noise multilayer PCB with discrete decoupling capacitors inside

Ki‐Jae Song, Jongmin Kim, Jongwoon Yoo, Wansoo Nah, Jaeil Lee, Hyunseop Sim

The purpose of this paper is to present the power noise characteristics of a multilayer printed circuit board (PCB) in which discrete capacitors have been embedded.

Reflow ageing influences and wettability effects of immersion tin final finishes with lead‐free solder

Thomas Hetschel, Klaus‐Jürgen Wolter, Fritz Phillipp

The purpose of this paper is to investigate the oxidation behaviour of an immersion tin final finish after multiple reflow ageing under air and nitrogen atmospheres and to study…

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  • Associate Professor Pooya Davari