Circuit World: Volume 32 Issue 4

Intermetallic compound formation and solderability for immersion tin

To investigate the relationship between intermetallic compound (IMC) formation and solderability for immersion tin deposit under different number of reflows.

Influence of the binder system on current and future demands for base materials

To give an overview of the problems that can occur with base laminate materials when converting to lead‐free soldering and to give guidance on possible solutions.

Can laser direct imaging (LDI) meet the needs of high density interconnect (HDI) mass‐production and packaging manufacturers?

To give an overview of the main needs of PCB manufacturers and to show how these needs can be met using laser direct imaging (LDI) technology.

New technologies for a sustainable printed circuit board manufacturing process: further results

To present an update and the latest results from work on a project aimed at enabling printed circuit board (PCB) manufacturing to become more sustainable.

European printed circuit board (PCB) technology and environmental trends: their impact on PCB supply from China

To give an introductory overview of the key issues that need to be addressed when manufacturing PCBs in China for the European market.

Technology roadmapping and the supply chain

To introduce the four key industry roadmaps used by the electronics industry and to illustrate which parts of the supply chain each serves.

Brominated flame retardants: their potential impacts and routes into the environment

To give an overview of the mechanisms by which brominated flame retardants (BFRs) used in the electronics industry enter, and are transported, in the environment. The potential…

The influence of temperature on the efficiency of electroplating from various ionic liquids

To study the influence of temperature on the electroplating efficiency of various metals from ionic liquids.

Printar's unique thermal ink passes MIL-PRF-55110F (marking ink) and A-A-56032D performance tests

EIPC summer conference – Venice 8-9 June 2006

Local electronic design company increases customer base by 20 per cent in the first quarter of 2006

AT&S Austria receives Sony-Ericsson Award

1st Annual Progress Report of flame retardant Voluntary Emissions Control Action Programme

Graphic Plc receives the "Crystal Globe" the ghly respected award from the West of England Aerospace Forum (WEAF), in the category of Competitiveness Improvement Programme (CIP)

MCE takes lead in developing "chip on board" reliability criteria

Internet commentary

New low-cost lead free development and evaluation kits from intertronics

Boundary-scan market-leader JTAG Technologies launches the JT 2127 series of DIOS DIMM modules

ICT evening seminar: restriction of hazardous substances

International diary

Electra Polymers acquires inks business from Rohm and Haas Electronic Materials

Adeon appoints Christopher Associates in North America

Outstanding paper &#34New materials and build-up constructions for advanced rigid-flex PCB applications"

First female graduate from ISLI

Exception EMS "in the frame" with Cintel

IPC announces new vice chairman and secretary/treasurer

Orbotech releases additional details of $18 million purchase agreement for PCB-AOI equipment