Circuit World: Volume 24 Issue 1

Encapsulant materials systems for flip‐chip‐on‐board assemblies: addressing manufacturing issues

Daniel R. Gamota, Cindy M. Melton

Encapsulant materials for flip‐chip‐on‐board (FCOB) were developed to address issues that have been observed during assembly of consumer electronic products on a high volume…

Conformal coating removal techniques

Hal Horrocks

Summarizes the different techniques for the removal of conformal coatings from printed circuit boards and other electronic assemblies. Addresses each of the four techniques for…

Flat panel displays – what is going on in East Asia outside Japan

Michael Pecht, Chung‐Shing Lee

Summarizes the flat panel display (FPD) industry outside of Japan, with a focus on advances in Korea and Taiwan. Discusses the major manufacturers in each country as well as their…

Development of axial laminographic system for electronic packaging inspection

Young‐Bin Cho, Dae‐Gab Gweon, Han J. Yun, Kyung R. Lee

X‐ray laminographic image can provide more useful information about the internal state of electronic packaging than x‐ray radiographic image does. Many kinds of laminographic…

UV curable conformal coatings and peelable masks which display enhanced fluorescent response

Stephen E. Cantor

Describes the use of a new type of UV cured coating and adhesive which are not adversely affected by fluorescing agents, so that increased quantities of fluorescing agents can be…

A low‐cost chip size package – NuCSP

T. Chou, J. Lau

Presents a new wire bondable land grid array (LGA) chip scale package called NuCSP. NuCSP is a minimized body size wire bondable package with rigid substrate interposer. The…

Solder bridging test to evaluate the compatibility for fine‐pitch microsoldering

Tadashi Takemoto, Tatsuya Funaki, Makoto Miyazaki, Akira Matsunawa

Establishes a quantitative evaluation method on solder bridging in microsoldering using a printed wiring board with comb pattern conductors. Bridge tests were conducted by…

Laser drilling of blind holes in FR4/glass

M. Owen, E. Roelants, J. Van Puymbroeck

In the last two years, laser drilled microvias have become the dominant method for producing blind vias smaller than 150 mm, with over 100 laser drilling machines with a variety…