Circuit World: Volume 23 Issue 1

Subject:

Table of contents

AK‐255 as a Drop‐in Replacement for CFC‐113 and HCFC‐141B

J.H. Cumbest, G.R. Unruh

CFCs and HCFCs have been used extensively in bulk cleaning of computer boards and are included in well established branch of chemistry. Due to the removal ofone such CFC…

145

Discrete Wiring: A Systems Approach To High Speed Design Problems

T.J. Buck

Increasing speedscombined with the level of integration that can be obtained with advanced IC technology hasdramatically changed the interconnection requirements for high…

184

Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages

S.‐W. Lee, J.H. Lau

This paper presents a non‐linear numerical study to investigate the effectof chip dimension and substrate thickness on the solder joint reliability of plastic ball grid…

220

Comparison of Methods for Characterising Soldering Fluxes and their Interactions with Substrates and Metallisation

L.J. Turbini

The 1980s and 1990s have seen the development of new andinteresting soldering flux formulations. Many of these fluxes exhibit improved solderingperformance or are favoured because…

356

General Principles of Design and Layout (of Printed Board Assemblies)

W. MacLeod Ross, G. Leonida

This issue of the journalfeatures the second part of a three part series which comprises Chapter 8 from Volume 1 of therecently published book ‘A Comprehensive Guide to the

446

Fine‐Line Applications of Ormet® Transient Liquid Phase Sintered Conductive Ink

P. Gandhi

In recent years, electronicdevices have increasingly employed printed circuits produced using electrically conductiveadhesives, commonly known as polymer thick films. This method…

227
Cover of Circuit World

ISSN:

0305-6120

Online date, start – end:

1974

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Associate Professor Pooya Davari