Circuit World: Volume 22 Issue 2

A Cost Comparison of New MCM Technologies

A.T. Singer

In thecourse of technology development, decisions must be made about the nature of future progress. To aidin this decision‐making process, Technical Cost Modelling has evolved…

Issues Affecting Early Affordable Access to Leading Electronics Technologies by the US Military and Government

M.G. Pecht

Military electronics have typically been isolated from mainstream developments due to military unique requirements,specifications and procurement policies. As a consequence…

Effects of High Electrical Stress in PCBs

C. Travi, M. Albertini*, C. Gemme*

The increasing level of integration in PCB technology demands from the designer a new level ofsensitivity to high electrical field problems and to the degradation processes that…

Development of Flip‐chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder*

J. Liu, K. Boustedt, Z. Lai

Electronic packaging is increasingly becoming a vital part of the electronics industry, representing a keybarrier to cost reduction and performance improvement. Of all the…

Controlled Thermal Expansion Printed Wiring Boards based on Liquid Crystal Polymer Dielecrics

K. Jayaraj, T.E. Noll, K. Blizard

L iguid crystal polymer(LCP) dielectric materials have been used to fabricate surface mount PWBs with acoefficient of thermal expansion matched to leadless ceramic chip carriers…

Laser Recording of Circuit Structures from Conducting Polymers in Insulating Polymer Layers

H.‐K. Roth, K. Eidner, H. Roth

The paper is a report on a newly developed materialand on technological studies which open up new methods for the combined application of laser andcomputer technology for advanced…

The Correlation between Short‐ and Long‐term SIR Testing

B.N. Ellis

Surface insulation resistance (SIR) testing is mainly used as a qualification procedure to determine the‘best’ combination of materials and processes for a given application. The…