Circuit World: Volume 20 Issue 1

Reducing Plated‐through Hole Copper Loss during Pin‐in‐hole Rework — Polymer Barrier Film Process

C.R. Davis

In an electronic manufacturing environment, rework of pin‐in‐hole components on printed circuit boards is an essential process. Rework enhances product yield and through‐put…

A Practical Solution for Low‐cost, High Performance MCMs

J. Hammond

An IC manufacturer's experience with a new technology for connecting bare chips to flexible PCBs is described. The process produces low‐cost fine line flexible PCBs and also…

Solder Joint Reliability of a Thin Small Outline Package (TSOP)

J. Lau, S. Golwalkar, P. Boysan, R. Surratt, R. Forhringer, S. Erasmus

The reliability of 0.5 mm pitch, 32‐pin thin small outline package (TSOP) solder joints has been studied by experimental temperature cycling and a cost‐effective 3‐D non‐linear…

Excimer Laser Structuring of Epoxy Resin Layers for MCM‐L Applications

P. Kersten, V. Glaw, H. Reichl

Multichip module packaging enables a significant increase of interconnect densities and performance of electronic systems. Multichip module technology based on laminate materials…

Conformal Coating Adhesion … To Stick or Not to Stick?

G.K. Naisbitt

Increased sophistication in the manufacture of electronic circuits, together with the ever more widespread adoption of conformal coatings, has led to new problems which are…

Computer Aided Design (CAD) for Printed Circuits Part 2

G. Ferrari

This paper, which will be published in two parts in consecutive issues of Circuit World, reproduces a chapter of the recently published book ‘Handbook of Printed Circuit…

Measurement of Coating Thickness via Micro‐resistance

T.D.T. Latter

Measurement of through‐hole copper in double‐sided and multilayer boards has been possible for a number of years by a micro‐resistivity method. Recent developments of this method…

Company Profile

Lorna Cullen

Situated in Scotland's ‘Silicon Glen’ and close to two of Scotland's great championship golf courses, Royal Troon and Turnberry, is Ayr's rurally located Mosshill Industrial…

PCIF News

T. Galbraith

Setting off on the short trip from the Isle of Man to London, it was a wet and windy day signalling the imminent arrival of another British winter. However, on arrival at…

International Institute News

CEMEX 94 ‐As requested by the 1992 Annual General Meeting, the CEMA Management Committee has been considering a number of options for the next CEMEX show, to be held in 1994.

EC/Japan PCB Procurement Project: A Community Pilot Programme to Develop Competitive Subcontracting for the Consumer Industry

B. Haken, P. Starkey

To improve the competitiveness of the European single‐sided PCB industry as supplied to the European Consumer Electronics Industry.

Printed Circuit World Convention VI: San Francisco, 11–14 May 1993

I.R. Christie

The Printed Circuit World Convention 1993 was held at the Fairmont Hotel, San Francisco, from 11–14 May 1993. The Convention was the sixth in the series held at three‐year…

A Voyage to the End of the World!: Brasage '93, Lannion, France, 14–16 September 1993

B.N. Ellis

The title of this review may be slightly misleading because Lannion is really a few kilometres from Finisterre, but it certainly seemed as if we were getting to the end of the…

Industry News

T. Galbraith

Flextronic Ltd, a UK leader in the manufacture and assembly of flexible circuits, have appointed Rob Lomer to the post of Quality Manager for both of their Chichester sites. Mr…

New Products

Ciba Polymers have invested 1.2 million Swiss francs in new application technology laboratories for their Electronic Materials Business Unit in Basel, Switzerland. The new…