Table of contents
Comparing Vision‐aided Stencil Printers
T. LancasterSurface Mount Technology relies on the use of screen or stencil printers for solder paste application. Many systems now incorporate complex vision systems to provide improved…
New Reliable Methods of Measuring Temperature Distribution on Printed Boards during Operation
A. Sihlbom, H. SvärdIVF has developed two new temperature measurement methods for PC boards and microelectronic devices as a result of Swedish national research programmes. This paper presents and…
Evaluation of the Corrosion and Reliability Aspects of Printed Circuit Boards Flow Soldered Using ‘No Clean’ Fluxes
G.J. Andrews‘No clean’ fluxes (NCFs) have been in existence for a few years now. The initial claimed advantages of these fluxes were that post flow soldering cleaning would not be required…
A Modern Approach to Drill Optimisation
R. RobertsThe drilling process in the manufacture of printed circuit boards is one where there is a wide variation in the optimum parameters used by each printed circuit board manufacturer…
An Advanced Selective Metallisation Process for PTH Manufacture
J. RoubalThe Geislingen research laboratories of Dr Ing. Max Schlötter have developed Slotoposit, a new and advanced process for the manufacture of high quality PTH circuits, using…
The Effects of Ultrasonic Cleaning on Device Degradation
B.P. Richards, P. Burton, P.K. FootnerAn investigation of the use of ultrasonic agitation for cleaning printed circuit boards using CFC‐based solvents has shown that, under the standard conditions required to produce…
Rework and Repair of Printed Wiring Assemblies
E.J. FloeterAdvancements in printed wiring technology have led to an increased demand for technicians with the knowledge and manual skills necessary to perform modifications, rework or…
A Process for Multi‐level Copper‐polyimide High Density Interconnect Structures, Flex Circuits and TAB Tape
D. Volfson, S.D. SenturiaThis paper describes a process for fabricating high density multilayer polyimide‐metal interconnect structures for packaging applications such as multichip carriers, flex circuits…
COSHH and the Printed Circuit Industry
G.D.M. MenziesThis paper is a digest of a series of presentations on this subject prepared and delivered by the author at a number of courses on Advanced Printed Circuit Manufacture arranged by…
Advances in Cleaning of Surface Mount Assemblies
G.M. Wenger, L.A. Guth, D.A. DickinsonNon‐corrosive rosin fluxes have historically been used for telephone communications assemblies because they provide a measure of reliability even if the flux is not totally…
Product Preview
Alpha Metals will be showing their extensive range of high quality solders, solder pastes and solder related chemicals in working production equipment in association with…
Printed Circuit World Convention 5
The fifth in the series of Printed Circuit World Conventions is being held in Glasgow, Scotland, from 12—15 June 1990. It is organised by the UK Printed Circuit World Convention…
PCIF News
A one‐day Technical Symposium on Printed Circuits will be held at the Swan Diplomat Hotel at Streatley on Thames, Berkshire, on Thursday 29 March 1990.
Industry News
Technical Director Appointed at Mommers Print Service. From January 1 1990, Mr A. F. J. G. van der Kruijs B.Eng. has been appointed Technical Director of Mommers Print Service BV…
New Products
A new inspection system from Astro Technology represents a major step forward in automated solder paste inspection, measuring both area and volume of solder paste deposition.
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari