Table of contents
Printed Circuits—Origins and Development: Part 3
M.E. Pole‐Bakerhe development of printed circuit technology is almost inseparable from the development of materials. Copper clad laminates could be said to have started with the discovery of…
The Role of Resin in Moisture Induced Laminate Failure
D.J. Vaughan, K.A. HouseholderThis paper considers the moisture induced failure of glass reinforced epoxy laminates, showing the loss of electrical properties versus time whether the environmental parameters…
Troubleshooting Wave Soldering Problems with Statistical Quality Control (SQC)
P. Prasad, D. FitzsimmonsIn an attempt to reduce the incidence of wave soldering defects on printed wiring assemblies, Boeing Electronics Systems Division (BESD) has been investigating and implementing…
Techniques for Soldering Surface Mounted Devices to Printed Circuit Boards
C.J. Brierley, L. Considine, D.J. PedderThe screen printing and reflowing of solder paste is compared with wave soldering for the attachment of surface mounted devices to PCBs. Both techniques have advantages and…
Factors Involved in the Design and Manufacture of Bonded Heat Sinks
L. PearlA review has been made of the various factors involved in the design and manufacture of bonded heat sinks for printed circuit boards. Among the factors discussed are the design of…
The Manufacture and Reliability of the EPIC Chip Carrier
F.N. Sinnadurai, D.J. SmallFollowing extensive studies that demonstrated that some types of plastic encapsulation can be used in high reliability environments, the EPIC chip carrier was conceived and…
Machining Multilayer Circuit Boards: Part 1
J.K. Hagge, J.C. MatherMachining operations on multilayer circuit boards play the two major roles of establishing the finished geometry of the board and leading to the interconnection of the various…
Photographic Imaging of UV Liquid Photoresists—A New, Fully Automated Process
E. ElsbergThe new process was developed to offer a superior method of forming a resist pattern on a copper‐clad laminate acting as plating and etch resist. The advantages over existing…
Correspondence
Dear Sir, The reply (in Vol. 10, No. 2, 1984) from Messrs P. M. Smith and R. Rolff to my correspondence regarding Mr Smith's paper ‘A New Method of Testing the Ductility of…
MAS SpA
A short history of the formation and development of MAS SpA appeared in Circuit World last year. This ‘biography’ traced the development of the company from its foundation, on…
Circuit Technology '84‐: An Unequivocal Success
Following the resounding success of Circuit Technology '84, it can be safely assumed that Circuit Technology has now become firmly established as a major event in the PCB…
ICT News
The Institute will be much in evidence at Brighton again this year. We shall have a stand, in the same position as last year, and we shall also be strongly represented in the…
Industry news
OMI International (GB) have announced that Allan Murray, one of the leading UK technologists in the field of plating through hole systems for the printed circuit industry, has…
New products
A new low cost precision engineered, high‐speed PCB drilling machine, the Oryx model PCD, has been introduced by Greenwood Electronics. Designed specifically to facilitate rapid…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari