Assembly Automation: Volume 30 Issue 3


The international journal of assembly technology and management

Table of contents - Special Issue: Assembly of micro and nanoscale electronics devices

The fabrication and assembly of nanoelectronic devices

Robert Bogue

The purpose of this paper is to provide a review of recent developments in nanoelectronic devices, with an emphasis on the materials and fabrication technologies employed.

Development and error compensation of laser soldering system

Zhenhua Xiong, Xinjue Zou, Yulin Wang, Han Ding

Accurate alignment is vital to acquire high‐quality joints with less negative effects on the rest parts of the chip or other components on a board. The purpose of this…

Nonlinear analysis and parameters identification of servo mechanism with relay feedback

DongLin Pu, JianHua Wu, ZhenHua Xiong, XinJun Sheng, Han Ding

The purpose of this paper is to explore the nonlinear analysis on the relay feedback technology (RFT) applied to parameters identification of servo mechanism.

Using CBR to develop a VR‐based integrated system for machining fixture design

Peng Gaoliang, Chen Guangfeng, Liu Xinhua

A fixture is a special tool used to accurately and stably locate the workpiece during machining process. Proper fixture design improves the quality and production of parts…

A flexible joints microassembly robot with metamorphic gripper

Luca Bruzzone, Giorgio Bozzini

The purpose of this paper is to report research which led to the realization of a robot for miniaturized assembly endowed with high‐accuracy and high‐operative flexibility.

Bulk nanostructure and amorphous metallic components using the electrospark welding process

M. Brochu, D.W. Heard, J. Milligan, S. Cadney

The purpose of this paper is to outline the feasibility of using the electrospark welding (ESW) process to free‐form metallic components with nanostructured or amorphous…

Assembly semantics modeling for assembling process planning in virtual environment

Hongmin Zhu, Dianliang Wu, Xiumin Fan

The purpose of this paper is to develop a modeling and interactive operating method for virtual assembly (VA) to support assembly process generation based on interactive operation.

Simple assembly line balancing problem under the combinations of the effects of learning and deterioration

M. Duran Toksarı, Selçuk K. İşleyen, Ertan Güner, Ömer Faruk Baykoç

The purpose of this paper is to describe the introduction of simple assembly line balancing problems (SALBPs) under four joint combinations of two learning effects and two…

Multi‐sensor information fusion in pulsed GTAW based on fuzzy measure and fuzzy integral

Bo Chen, Shanben Chen

The status of welding process is difficult to monitor because of the intense disturbance during the process. The purpose of this paper is to use multiple sensors to obtain…




Online date, start – end:

1980 – 2022

Copyright Holder:

Emerald Publishing Limited


  • Prof Hong Qiao