Assembly Automation: Volume 24 Issue 1


The international journal of assembly technology and management

Table of contents

Problems of machine/component interference in very high‐speed assembly processes using continuous motion technology

François Paillusseau

Continuous motion technology allows very high machine outputs for assembly and test operations. This paper presents the main advantages of continuous motion process…

Mikron extends modularization

Richard Bloss

Modularization continues to evolve in the automated assembly system business. Mikron Technology Group, a Swiss headquartered system developer, has extended modularization…

Marching towards MEMS

David Bak

Standardized systems for feeding, gripping, and joining are needed to realize the potential of microsystem and nano‐system technology. This paper describes many several…

A four‐degree‐of‐freedom microprehensile microrobot on chip

Pierre De Lit, Joël Agnus, Cédric Clévy, Nicolas Chaillet

This paper presents a cheap and easy‐to‐produce microprehensile microrobot on chip (MMOC). This four‐degree‐of‐freedom (DOFs) microprehensor is able to grip, hold and…

Building a mini‐assembly system from a technology construction kit

Tobias Gaugel, Matthias Bengel, Dirk Malthan

As part of this paper, extracts will be presented from the results of the joint project “MiniProd”, which is carried out by the Fraunhofer IPA together with industrial…

Aspects on design of high precision parallel robots

Jürgen Hesselbach, Jan Wrege, Annika Raatz, Oliver Becker

This paper presents a concept for a micro‐assembly station and shows different possibilities for increasing the positioning accuracy. The main part of the station consists…


Robotic assembly and joining of miniature and MEMS components using adhesive films – test environment and experiences

Ilpo Karjalainen, Teemu Sandelin, Jani Uusitalo, Reijo Tuokko

Currently, adhesive films are replacing glue in many applications in semiconductor packaging and microelectronic assembly. When adhesive films are used to mount components…

Data modelling for web enabled design of modular precision assembly devices

Svetan Ratchev, Niels Lohse

One of the key factors for success in assembly automation at present is the ability of system integrators to deliver more reliable and customised systems within shorter…

Force‐guided robot in automated assembly of mobile phone: overcoming component misalignment

Kong Suh Chin, Mani Maran Ratnam, Rajeswari Mandava

This paper describes the development of a force‐guided robot that uses the information of contact force to overcome component misalignment in the automated assembly of a…

Haptic interface for a nanohandling robot

A. Shirinov, J. Kamenik, S. Fatikow

Miniaturised nanohandling microrobots are used to handle objects of less than 100 μm size with accuracy down to several nanometres. Operating a nanohandling robot in the…

A classification scheme for quantitative analysis of micro‐grip principles

Marcel Tichem, Defeng Lang, Bernhard Karpuschewski

This paper proposes a classification scheme for the quantified analysis of micro‐grip principles. Micro‐part gripping has received quite some attention in micro‐assembly…


Mini assembly cell for the assembly of mini‐sized planetary gearheads

J.J. Uusitalo, H. Viinikainen, R. Heikkilä

This paper discusses a novel assembly method and system for a commercially available 8 mm diameter miniature planetary gearhead. Our system comprises a commercially…




Online date, start – end:

1980 – 2022

Copyright Holder:

Emerald Publishing Limited


  • Prof Hong Qiao