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A Static Analysis of Snap Back in the Cantilever with Mems Adhesion

Wenchao Tian (School of electromechanical engineering, Xidian University, Xi’an, 710071, China)
Jianyuan Jia (School of electromechanical engineering, Xidian University, Xi’an, 710071, China)
Guiming Chen (School of electromechanical engineering, Xidian University, Xi’an, 710071, China)
Guangyan Chen (Institute of southwest electronic engineering, Mianyang, 621000, China)

Multidiscipline Modeling in Materials and Structures

ISSN: 1573-6105

Article publication date: 1 January 2006

85

Abstract

The “Snap back” problem of the micro‐cantilever remains one of the dominant failure mechanisms in the Micro Electro‐mechanical System (MEMS). By analyzing the Hamaker micro continuum medium and solid physics principle, the consistency model of Wigner‐Seitz (W‐S) continuum medium is presented. The gap revision coefficients of the body with the face‐centered cubic structure are derived, which include the attractive force and the repulsive one. The adhesion model of the 500 µ m X 1 µ m silicon micro‐cantilever coated by Au is established. The micro‐cantilever static relationship between the elastic force and the adhesion force is discussed. The reason of the microcantilever “snap back” problem, an instable balanced point, is discovered. Increasing the rigidity of the micro‐cantilever, a method to avoid the micro‐cantilever “snap back” to happen, is put forward, which improves MEMS structure design and enhances MEMS reliability.

Keywords

Citation

Tian, W., Jia, J., Chen, G. and Chen, G. (2006), "A Static Analysis of Snap Back in the Cantilever with Mems Adhesion", Multidiscipline Modeling in Materials and Structures, Vol. 2 No. 1, pp. 83-93. https://doi.org/10.1163/157361106775249916

Publisher

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Emerald Group Publishing Limited

Copyright © 2006, Emerald Group Publishing Limited

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