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Generalized Electromagneto‐Thermoelastic Plane Waves by Thermal Shock Problem in a Finite Conductivity Half‐Space with One Relaxation Time

Mohamed I. A. Othman (Faculty of Education, Department of mathematics Salalah‐ 211 P.O. Box 2801, Sultanate of Oman)

Multidiscipline Modeling in Materials and Structures

ISSN: 1573-6105

Article publication date: 1 March 2005

110

Abstract

A two‐dimensional coupled problem in electromagneto‐thermoelasticity for a thermally and electrically conducting half‐space solid whose surface is subjected to a thermal shock is considered. The problem is in the context of the Lord and Shulman’s generalized thermoelasticity with one relaxation time. There acts an initial magnetic field parallel to the plane boundary of the half‐space. The medium deformed because of thermal shock and due to the application of the magnetic field, there result an induced magnetic and an induced electric field in the medium. The Maxwell’s equations are formulated and the electromagneto‐thermoelastic coupled governing equations are established. The normal mode analysis is used to obtain the exact expressions for the considered variables. The distributions of the considered variables are represented graphically. From the distributions, it can be found the wave type heat propagation in the medium. This indicates that the generalized heat conduction mechanism is completely different from the classic Fourier’s in essence. In generalized thermoelasticity theory heat propagates as a wave with finite velocity instead of infinite velocity in medium. Comparisons are made with the results predicted by the coupled theory for two values of time.

Keywords

Citation

Othman, M.I.A. (2005), "Generalized Electromagneto‐Thermoelastic Plane Waves by Thermal Shock Problem in a Finite Conductivity Half‐Space with One Relaxation Time", Multidiscipline Modeling in Materials and Structures, Vol. 1 No. 3, pp. 231-250. https://doi.org/10.1163/157361105774538557

Publisher

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Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited

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