Higher density

Work Study

ISSN: 0043-8022

Article publication date: 1 July 2000



(2000), "Higher density", Work Study, Vol. 49 No. 4. https://doi.org/10.1108/ws.2000.07949dab.010



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Higher density

Sheldahl, Inc. recently introduced the Density PatchTM, an innovative extension of its flexible circuitry line that makes it possible to incorporate lower density circuits into larger assemblies at minimal cost. The new solution is designed for specialised functions such as automotive instrumentation, electrical control units, consoles and other applications requiring a small number of electrical components to be deployed affordably and efficiently over a large circuit. Assembled to order for each customer, the Density Patch is a small high-density circuit populated on one of Sheldahl's Novaflex® flexible circuit materials. This small pre-tested assembly is then attached to a lower density polyester substrate through a permanent lap solder connection, allowing the patch to piggyback on a larger and less costly circuit. This eliminates the need to use large volumes of a more expensive material capable of withstanding the heat of the solder process. It also increases manufacturing efficiencies by eliminating the need to place a small number of components over a large area. Depending on the specific requirements of the application, customers should realise a cost saving of 10 to 25 per cent. See http://www.sheldahl.com.

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