TY  - JOUR
AB  - 
VL  - 24
IS  - 1
SN  - 0954-0911
DO  - 10.1108/ssmt.2012.21924aaa.020
UR  - https://doi.org/10.1108/ssmt.2012.21924aaa.020
PY  - 2012
Y1  - 2012/01/01
TI  - Super Dry launches oxidation-free process alternative to MSD and PCB baking
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/25
ER  -