Israeli EMS provider invests in scalable SIPLACE SX line

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 3 February 2012

311

Citation

(2012), "Israeli EMS provider invests in scalable SIPLACE SX line", Soldering & Surface Mount Technology, Vol. 24 No. 1. https://doi.org/10.1108/ssmt.2012.21924aaa.016

Publisher

:

Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited


Israeli EMS provider invests in scalable SIPLACE SX line

Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 24, Issue 1

EMS provider USR Electronics Systems Ltd has made its operation significantly more flexible by setting up the first SIPLACE SX production line in Israel. The innovative SIPLACE placement heads, the highly efficient setup concepts and the capacity-on-demand concept of the SIPLACE SX provide USR Electronics Systems with maximum flexibility and scalability with regard to module layouts and lot sizes. By making this move, the Israeli electronics manufacturer is once again banking on placement solutions from ASM Assembly Systems (formerly Siemens Electronic Assembly Systems) to produce complex electronic modules for customers in the medical technology, telecommunication or IT fields.

USR Electronics Systems’ new line consists of three SIPLACE SX2 machines. The first machine is equipped with the SIPLACE CP20 SpeedStar high-speed head. Thanks to its innovative SIPLACE MultiStar CPP head, the second machine can operate in Collect & Place or Pick & Place mode, which enables it to process an exceptionally broad component spectrum.

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