Enthone receives Best Presentation Award at SMTA China East Conference

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 20 September 2011

Citation

(2011), "Enthone receives Best Presentation Award at SMTA China East Conference", Soldering & Surface Mount Technology, Vol. 23 No. 4. https://doi.org/10.1108/ssmt.2011.21923daa.003

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited


Enthone receives Best Presentation Award at SMTA China East Conference

Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 23, Issue 4

Enthone Inc., a business of Cookson Electronics was awarded “Best Presentation – Vendor Conference” at the Surface Mount Technology Association (SMTA) China East Conference, May 12-13 in Shanghai, People’s Republic of China. The Enthone presentation, “ENTEK® OM: an OSP alternative high performance final finish”, detailed a distinctive new class of PWB final finish that provides solid performance benefits to OEMs, ODMs, EMSs and PWB fabricators.

Mr James Kenny, Enthone PWB Global Technical Manager and Mr Ken Chow, Enthone Asia PWB OEM and Business Development Director were the co-presenters. Mr Chow stated, “We are truly honoured to receive this award. It recognizes the strong interest ENTEK OM has generated throughout our industry. ENTEK OM exemplifies Enthone’s commitment to PWB final finish innovation”.

Mr Kenny added, “ENTEK OM was specifically developed to create value for the entire supply chain. It unites the high reliability and cost-effectiveness of an organic solderability preservative with the desired attributes of a metallic finish. Specifically, the process delivers solderability that exceeds traditional organic solderability preservatives and is comparable to metallic finishes as tested with the industry’s leading fluxes and solder pastes”.

ENTEK OM delivers a visible, highly conductive PWB final finish that offers both ease of inspection and in-circuit testing. The need to paste test points during board assembly is eliminated. ENTEK OM substantially reduces board rejects and rework, while providing exceptional solderability which results in higher assembly yields. Further information on ENTEK OM may be obtained by contact the web sites: (English) www.enthone.com/entekom/ or (simplified Chinese) www.enthone.com/entekom/ch/index.aspx