New frameless stencil foil available on-line

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 28 June 2011



(2011), "New frameless stencil foil available on-line", Soldering & Surface Mount Technology, Vol. 23 No. 3.



Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited

New frameless stencil foil available on-line

Article Type: New products From: Soldering & Surface Mount Technology, Volume 23, Issue 3

Alpha® TetraBond™ the new “frameless” stencil foil from Cookson Electronics is available to order on-line through the Solder Connection.

Described as the “evolution of frameless stencil technology” the new Alpha® TetraBond™ uses an innovative and proprietary process to Direct Bond the stencil foil to a thin, safe and easy to handle, round cornered sub-frame, ready for loading in any existing TETRA™, Vector™ or VectorGuard™ frame.

Direct bonding removes the need to pre form an engagement mechanism in the foil, and ensures the tensioning pressures are applied and distributed evenly from all four sides of the mounting frame.

Being cleverly engineered from a single piece of anodised extrusion, the sub-frame has vastly enhanced rigidity, making handling, mounting and demounting easier and making the foil less susceptible to accidental stretching. Its rounded corners and profile also remove any lingering health and safety concerns. The sub-frames are black anodised but for those wishing to identify lead-free stencils, a green anodised option is available.

Alpha® TetraBond™ foils are available for all Cookson’s stencil technologies (Alpha® Cut™, Alpha® Form™ and Alpha® Nickel-Cut™) to suit all frame sizes.

For further information, please visit the web site:

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