Citation
(2011), "International diary", Soldering & Surface Mount Technology, Vol. 23 No. 3. https://doi.org/10.1108/ssmt.2011.21923caa.027
Publisher
:Emerald Group Publishing Limited
Copyright © 2011, Emerald Group Publishing Limited
International diary
Article Type: International diary From: Soldering & Surface Mount Technology, Volume 23, Issue 3
2011SMART GroupEnergy Harvesting & Storage Europe 2011
21-22 June
Munich, GermanyContact: E-mail: c.evans@idtechex.comWeb site: www.IDTechEx.com
Wireless Sensor Networks & RTLS Europe 2011
21-22 June
Munich, GermanyContact: E-mail: c.evans@idtechex.comWeb site: www.IDTechEx.com
Electric Vehicles: Land, Sea, Air Europe 2011
28-29 June
Stuttgart, GermanyContact: E-mail: c.evans@idtechex.comWeb site: www.IDTechEx.com
PCB Specification – What an Engineer Needs to Cover
5 July
Online smart-e-webinar
IPCA Expo 2011
3-5 August
KTPO Trade Centre, Bangalore, IndiaContact: E-mail: ipca@ipcaindia.org
EMPC 2011European Microelectronics & Packaging Conference
12-15 September
Brighton Metropole, Sussex, UKContact: E-mail: secretariat@imaps.org.uk
RFID Europe 2011
27-28 September
Cambridge, UKContact: E-mail: c.evans@idtechex.comWeb site: www.IDTechEx.com
Green & Portable Energy Workshop
29 September
Tyndall National Institute, Cork
SMART GROUP Annual Conference & Exhibition 2011
5-6 October
The Oxfordshire, ThameWeb site: www.smartgroup.org
TPCA Show
19-21 October
Taipei Nangang Exhibition Centre, TaipeiWeb site: www.tpca.org
Productronica
15-18 November
Messe München, GermanyWeb site: www.productronica.de
Silicon to Package Incorporating the EU uBGA Project
17 November
Intel, Leixlip, Ireland
Printed Electronics & Photovoltaics USA 2011
30 November-1 December
Santa Clara, CA, USAContact: E-mail: c.evans@idtechex.comWeb site: www.IDTechEx.com
HKPCA International Printed Circuit & Electronics Assembly
2-4 December
Shenzhen Convention & Exhibition Centre, ChinaWeb site: www.hkpca.org