Don Dupriest inducted into IPC Hall of Fame

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 28 June 2011

277

Citation

(2011), "Don Dupriest inducted into IPC Hall of Fame", Soldering & Surface Mount Technology, Vol. 23 No. 3. https://doi.org/10.1108/ssmt.2011.21923caa.022

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited


Don Dupriest inducted into IPC Hall of Fame

Article Type: Appointments and awards From: Soldering & Surface Mount Technology, Volume 23, Issue 3

In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees and exceptional lifetime achievement, Don Dupriest, Lockheed Martin, was awarded the 2010 IPC Raymond E. Pritchard Hall of Fame Award.

Presented at IPC APEX EXPO™ in Las Vegas, the Hall of Fame Award represents IPC’s highest level of member recognition.

For nearly 40 years, Dupriest has been providing his expertise to Lockheed Martin and for nearly 25 years, he has been lending his expertise to IPC. Among his contributions, he has chaired the IPC D-30 Rigid Printed Board Committee and is current Co-chair of the IPC D-35 Printed Board Storage and Handling Subcommittee. He is also a past recipient of the IPC President’s Award, and a past Chair and current member of the IPC Technical Activities Executive Committee.

When he is at his office, Dupriest serves as a subject-matter expert in production operations for Lockheed Martin Missiles and Fire Control in Dallas, Texas. In his role, he provides leadership in interconnect technology development for electronic manufacturing and is responsible for advanced technology, process development and product manufacturability for electronic systems. And, when he is not directly supporting a program, Dupriest can be found leading various working group initiatives in the newly formed Corporate Leadership Forum for Electronics Engineering and Packaging. These working groups focus on design, lead-free technology and sourcing.

Commenting on his accomplishments, Dupriest reflects, “When I look back I know I have left my footprints all over several standards and I’m very proud of this. I always try to write requirements first in light of the technology and always in light of all parties impacted. Then the committee does the rest; it’s truly a team effort. As a leader, it’s all about being able to mediate a common solution with inclusion that is good for all (users and suppliers). Perhaps, my greatest contribution was to just seed technical content for discussion and provide a starting point for the standards that I worked on.”

As for his dedication to IPC and industry, he adds, “I have benefited from the collective knowledge and developed a great network of friends and colleagues in the field. Technology changes quickly and you get directly exposed to it developing standards. I know it has benefited me in my job as well since we use standards for internal and external sub-contracted electronics. I think, as with any volunteer work, you get back more than you give.”

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