TechSearch International Founder and President highlights shift to Cu pillar in keynote address at ICEP in Japan

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 28 June 2011

1602

Citation

(2011), "TechSearch International Founder and President highlights shift to Cu pillar in keynote address at ICEP in Japan", Soldering & Surface Mount Technology, Vol. 23 No. 3. https://doi.org/10.1108/ssmt.2011.21923caa.015

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited


TechSearch International Founder and President highlights shift to Cu pillar in keynote address at ICEP in Japan

Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 23, Issue 3

E. Jan Vardaman, President and Founder of TechSearch International, delivered a keynote address at the International Conference on Electronics Packaging (ICEP) held in Nara, Japan, April 13-15. One of the key messages in her presentation was the trend toward the adoption of Cu pillar as highlighted in TechSearch International’s recent study, flip chip and WLP: market projections and new developments.

Since Intel’s adoption of copper, many companies are moving to adopt copper pillar as the technology for its flip chip applications. Intel started with the use of copper pillar in its 65 and 45 nm flip chip product lines, and is using the technology in its 32 nm products. The first products were the “Presler” and “Yonah” processors, but today Intel uses the copper pillar process in all of its flip-chip products, including its Atom processor. Cu pillar with a solder cap has also been used for GaAs and silicon in RF modules for several years. Amkor has been shipping RF power amplifier and RF front-end modules with Cu pillar bumps for more than four years. Drivers included size, performance, and cost. Copper pillar is also shipping in leadframe packages from companies including Carsem and Unisem. IBM developed a copper pillar process called C2 that has been introduced for wire bond die with 50 μm pitch or larger. TI has recently announced its use of Cu pillar in the bottom package of its PoP offering. Advantages of copper pillar, or copper post as it is sometimes called, were highlighted in TSMC’s recent technology day when TSMC presented its roadmap for the technology. Vardaman noted that “the move to copper pillar is similar to the industry’s progression from the evaporated bump to the plated bump and a major shift is expected in the 2013-14 timeframe.”

Highlighted in the ICEP Cu pillar with a solder cap has also been used for GaAs and silicon in RF modules for several years. Amkor has been shipping RF power amplifier and RF front-end modules with Cu pillar bumps for more than four years. Drivers included size, performance and cost. Copper pillar is also shipping in leadframe packages from companies including Carsem and Unisem. Presentation was STATS ChipPAC’s low-cost FC-CSP is based on copper columns, bond-on-lead interconnection, and molded underfill. A 20 to 40 percent lower cost over standard flip-chip packages for most designs has been reported. Several subcontract assembly operations offer molded underfill, including Amkor, ASE and STATS ChipPAC.

The tremendous interest in copper pillar was evident at ICEP with a standing room only crowd listening to ASE’s presentation on its plans for Cu pillar in FC-CSPs.

TechSearch International, Inc. founded in 1987, is market research firm specializing in technology trends microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia and Europe. For more information, contact TechSearch at: tel.: 512-372-8887, fax: 512-372-8889, or www.techsearchinc.com

Related articles