SMS Electronics selects SIPLACE for major UK investment

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 28 June 2011



(2011), "SMS Electronics selects SIPLACE for major UK investment", Soldering & Surface Mount Technology, Vol. 23 No. 3.



Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited

SMS Electronics selects SIPLACE for major UK investment

Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 23, Issue 3

SMS Electronics Limited, based in Beeston near Nottingham, UK, is one of the UK’s leading electronics manufacturing services companies, providing services to a wide market sector, ranging from industrial applications, to consumer electronics, medical and leisure uses. As part of a $2million investment program and due to increasing capacity requirements as a result of continued growth, SMS Electronics has purchased additional SIPLACE placement equipment from ASM Assembly Systems (formerly Siemens Electronics Assembly Systems). The new equipment – SIPLACE X3 and SIPLACE X4 – will be set up in a separate line to the already existing SIPLACE placement machines on site at SMS and thereby providing further innovative manufacturing solutions on the vast 11,000 m2 of production floor.

SMS Electronics Limited in Beeston, UK is committed to providing high-quality contract electronics manufacturing and hence, is continually investing to stay at the forefront of manufacturing technology. Mike Harby, Managing Director, SMS Electronics Limited comments, “Our company vision is to be the leading UK provider of electronics manufacturing services, delivering excellence in manufacturing and total customer satisfaction. By continuing our partnership with SIPLACE & ASM Assembly Systems, I am confident we will achieve our vision”. At the heart of the recent $2million investment program is the SIPLACE X3 and SIPLACE X4 placement equipment. The placement machines are equipped with the revolutionary SIPLACE MultiStar CPP head, SIPLACE TwinStar, as well as the SIPLACE SpeedStar head to ensure maximum flexibility and maximum performance.

The products which will be manufactured on the new line fit perfectly into the SIPLACE equipment’s capabilities – many different sized components on a range of very complex PCBs’. The new line will greatly benefit from the four SIPLACE MultiStar CPP heads which are capable of handling components ranging from 01005 to 50×40 mm, each at maximum placement performance, and guarantee a perfectly balanced line at all times without having to switch out heads.

For more information, please visit the web site:

Related articles