CitationDownload as .RIS
Emerald Group Publishing Limited
Copyright © 2008, Emerald Group Publishing Limited
Soldertec Global offers new “Same Day X-ray inspection service
Article Type: New products From: Soldering & Surface Mount Technology, Volume 20, Issue 3
Soldertec Global has launched a new “inspection while you wait” service using the Dage XiDAT 7600 X-ray inspection system. It is also possible for Soldertec Global to guarantee a 24 h turnaround for companies who prefer to ship the boards via courier. The ability of X-rays to penetrate through entire assemblies has enabled solder joint inspection of hard-to-access areas, including underneath BGA and flip-chip components. Missing, open, malformed and bridged BGA interconnections and misaligned components can now all be detected quickly and easily.
The Dage XiDAT 7600 system is capable of sub-micron resolution (>600 nm) at high magnifications. The contrast levels achievable using the digital image acquisition system, are more sensitive than traditional analogue systems. Thus, allowing subtle features to be easily identified, which can be used to assess structures and processes, and diagnose problems. Via alignment issues, metallisation shorts, plated-through hole barrel cracking and other PCB problems can also be identified.
The Dage XiDAT 7600 X-ray Inspection System will be on demonstration in the “Live Technologies Area” at the “National Electronics Week”, Earls Court, from the 17 to 19 June. Companies wishing to discuss their requirements with Soldertec Global and any aspects of this inspection system may visit their stand, which is E88.
Companies requesting a quotation or interested in booking this service, should contact Zoe Sullivan by Tel.: 01727 875544 or by e-mail at: firstname.lastname@example.org