TY  - JOUR
AB  - 
VL  - 20
IS  - 3
SN  - 0954-0911
DO  - 10.1108/ssmt.2008.21920cad.008
UR  - https://doi.org/10.1108/ssmt.2008.21920cad.008
PY  - 2008
Y1  - 2008/01/01
TI  - Award-winning ProFlow® technology from DEK evolves to broaden capability and expand process window
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/09/18
ER  -