International diary

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 27 June 2008

Citation

(2008), "International diary", Soldering & Surface Mount Technology, Vol. 20 No. 3. https://doi.org/10.1108/ssmt.2008.21920cac.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited


International diary

Article Type: International diary From: Soldering & Surface Mount Technology, Volume 20, Issue 3

2008

2009 iNEMI Roadmap Workshop – Asia

28 July

Shanghai, China

Contact: For additional information: www.inemi.org

EIPC Workshop on Contract Drilling Routing & Scoring

August, Dates TBA

Graz, Austria

Contact: www.eipc.org

EIPC Joint Conference with Publish House

SeptemberDates and location: TBA

Moscow, Russia

Contact: www.eipc.org

EIPC Workshop on technology, processes and materials for rigid-flex circuitry

SeptemberDates and location: TBA

Contact: www.eipc.org

EIPC Workshop on via hole plugging

SeptemberDates and location: TBA

Contact: www.eipc.org

IPC Midwest

24-25 September

Schaumburg, Illinois, USA

Contact: www.ipc.org

Printed Electronics Asia

7-9 October

Tokyo, Japan

TPCA Show

22-24 October

Taipei, Taiwan

Contact: www.tpca.org.tw

IONMET/PROSURF Dissemination Seminar at ELECTRONICA 2008

11-14 November

Messe München

Contact: www.eipc.org

Printed Electronics US

3-4 December

San Jose, USA

2009Photovoltaics Europe

January

Berlin, Germany