TY - JOUR AB - VL - 20 IS - 1 SN - 0954-0911 DO - 10.1108/ssmt.2008.21920aac.001 UR - https://doi.org/10.1108/ssmt.2008.21920aac.001 PY - 2008 Y1 - 2008/01/01 TI - Call for papers for China SMT Forum 2008 now open T2 - Soldering & Surface Mount Technology PB - Emerald Group Publishing Limited Y2 - 2024/03/28 ER -