TY  - JOUR
AB  - 
VL  - 17
IS  - 4
SN  - 0954-0911
DO  - 10.1108/ssmt.2005.21917dad.004
UR  - https://doi.org/10.1108/ssmt.2005.21917dad.004
PY  - 2005
Y1  - 2005/01/01
TI  - Hysol® QMI538NB delivers excellent thermal stability and superior adhesion strength
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/09/22
ER  -