TY  - JOUR
AB  - 
VL  - 17
IS  - 4
SN  - 0954-0911
DO  - 10.1108/ssmt.2005.21917dad.002
UR  - https://doi.org/10.1108/ssmt.2005.21917dad.002
PY  - 2005
Y1  - 2005/01/01
TI  - DEK wafer bumping and ball placement solutions
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/25
ER  -